COATING RESINS

PRODUCT INFORMATION :

KK-115 is a general purpose liquid amino polyamide resin. It is used in conjunction with suitable epoxy resins to produce both top coats and primers as well as thermosetting adhesives for wide variety of substrates. The main characteristics are its excellent resistance and good exterior durable properties and adhesion to metallic substrates. It is compatible with many synthetic resins, varnishes, oils and other media.

RECOMMENDATIONS FOR USE :

The selection of a particular grade of epoxy will depend upon the end use of the product. It is recommended that for high build coating it is always recommended to use low molecular weight epoxy. In solvent based coatings medium molecular weight and unmodified liquid epoxy resins may be used, while for adhesive applications either the unmodified or modified liquid epoxy resins are recommended. While the mixing ratio using KK-115 polyamides is not critical, optimum performance of the coating is achieved by stoichiometric mixing of the epoxy resin and KK-115. The mix ratio is calculated on the basis of one Active Hydrogen Equivalent weight of the polyamide resin, will react with each epoxy group in the base resin. The AHEW of the polyamide resin KK-115 is typically 240 on solid resin. Considering that each epoxy reacts with one active hydrogen the mix ratio of KK-115 and an epoxy resin with epoxide equivalent approx. 500 is calculated as follows;

65:35 based on solid resin. Excess polyamide in a coating will Impart flexibility and adhesion at the expense of solvent resistance.

CURE RATE :

A 65:35 epoxy resin: KK-115 blend on solid resin will reach a tack free time in 30 mins. At 25°c. Film will obviously dry more rapidly if higher molecular weight epoxy resins are used. An induction period to ensure complete compatibility is recommended. Cure of epoxy::polyamide can be accelerated by the addition of catalysts and in particularly Tris ( dimethylaminomethyl) phenol types which are recommended for use at a level of 1 – 5 % ( calculated by weight on total resin). It should be noted, that when catalysts are employed pot life will be reduced and there may be an adverse effect on flexibility and colour.

POTLIFE :

Reaction between the epoxy resin and KK-115 will commence as soon as the reactants are mixed . A65:35 epoxy: KK-115 mixture on solid resin will have a limited pot life. Solvents will have a considerable effect on pot life e.g. alcohols tend to reduce it’s pot life where as esters and ketones tend to extend it. Since ketones and esters form complexes with amino polyamides on storage, these solvents should only be incorporated into the epoxy resin component.

ADHESIVES :

KK-115: epoxy resin systems demonstrate excellent adhesion to a wide variety of surfaces, such as glass, wood, ceramics, and masonry, leather and plastic substrates. The pot life of a KK-115: epoxy resin adhesives will cure at ambient temperature but cure time can be reduced by heating to elevated temperature.

COATING RESINS (KK- 125)

PRODUCT INFORMATION :

KK-125LV is a medium viscosity liquid amino polyamide resin used in conjunction with epoxy resins to produce high build coatings and structural and laminating adhesives. It is used where the prime requirement are fast cure and flexibility. It is compatible with many synthetic resins, varnishes, oils and other media.

RECOMMENDATIONS FOR USE :

The selection of a particular grade of epoxy will depend upon the end use of the product. It is recommended that for high build coating it is always recommended to use low molecular weight epoxy. In solvent based coatings medium molecular weight and unmodified liquid epoxy resins may be used, while for adhesive applications either the unmodified or modified liquid epoxy resins are recommended. While the mixing ratio using polyamides is not critical, optimum performance of the coating is achieved by stoichiometric mixing of the epoxy resin and KK-125. The mix ratio is calculated on the basis of one Active Hydrogen Equivalent weight of the polyamide resin, will react with each epoxy group in the base resin. The AHEW of the polyamide resin KK-125 is typically 130 on solid resin. Considering that each epoxy reacts with one active hydrogen the mix ratio of KK-125 and an epoxy resin with epoxide equivalent approx. 500 is calculated as follows;

The resulting epoxy: polyamide mix ratio in this case is approx. 80:20 based on solid resin. Excess polyamide in a coating will Impart flexibility and adhesion at the expense of solvent resistance.

CURE RATE :

A 75:25 epoxy resin: KK-125 blend on solid resin will reach a tack free time in 180 mins. At 25°c. Film will obviously dry more rapidly if higher molecular weight epoxy resins are used. An induction period to ensure complete compatibility is recommended. Cure of epoxy::polyamide can be accelerated by the addition of catalysts and in particularly Tris ( dimethylaminomethyl) phenol types which are recommended for use at a level of 1 – 5 % ( calculated by weight on total resin). It should be noted, that when catalysts are employed pot life will be reduced and there may be an adverse effect on flexibility and colour.

POTLIFE :

Reaction between the epoxy resin and KK-125 will commence as soon as the reactants are mixed. A75:25 epoxy: KK-125 mixture on solid resin will have a limited pot life. Solvents will have a considerable effect on pot life e.g. alcohols tend to reduce it’s pot life where as esters and ketones tend to extend it. Since ketones and esters form complexes with amino polyamides on storage, these solvents should only be incorporated into the epoxy resin component.

ADHESIVES :

KK-125: epoxy resin systems demonstrate excellent adhesion to a wide variety of surfaces , such as glass , wood , ceramics, masonry, leather and plastic substrates. The pot life of a KK- 125: epoxy resin adhesives will cure at ambient temperature but cure time can be reduced by heating to elevated temperature.